Soldering compound and method of making the same



n it 8. Jew City, N. 3., My

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m Solder Go. the, New n. r. s Wtporetion of York 1o geneous t; is;thoroughly intermingled, whereby proper ount of flux is always presentin i 1 l. position to the necessary ount of solder.

A 1 l or object of the invention is to combine e meiy dividedsolder.with a. finely divided flux exerting grt pr upon both the solderd flux after they are mixed vand causing them to intele and become ahomogeneous m vingbody and rigidity and which y he made into sticks,cakesor the like for lib invention further cots of method @loyedforproducing my improved solder and tor. e invention 11 i other objects.oil of which will be hereinafter set math and claimed. Described ingeneral the invention ciolly consists in so finely i 1 metallic solder do suitable flux that they will, by the application of pressure, form ahomogeneous, rigid mass i; may beiormed into sticks or the like and wedin form to apply it to the work to be done. The extreme pre employed incombining the solder and the flux in a dry state so integles d inter-loothe ins of the solder d the flux that they practically become so solid oand any oi the shifting oi solder or flux that might disturb the o ratiooi solder sndflux in sny given ares,

is thus obviated.

in WT"; up my improved mixture, I prefer to employ zinc onium chloride.This zinc wh chloride is first reduced to a very time powder and 11mixed with the powdered till tin or tin d lend powder end powdered medoin the following portions:

plog t follow-1::

' Percent dolor zinc chloride 3b oni chloride B7 c tin der d0 wdmetullic zinc 3 en chlorides are mixed with themetal cointointlmsteconisbrot ut which (on. 1) I prevents the zinc chloride fromabsorbing moisture and thus "enables the finished powder to be alwaysmaintained in a dry state which is necessary to its proper use.

It has found that zinc chloride ordinsrily absorbs moisture very rapidlyand the addltlon oi metallic zinc to soldering materials has forthisbeenavoided as the absorption oi moisture causes the deterioration oi thesoldering material. I have found, howet'br, that 10 by the addition of avery small percentage of zinc, the solder does not seem to be undulyaflected and will not become sluggish as it ordinarily would. .Ihis zincin anywhere from 3% to 10% quantities does not seem to aflect theflowing of the solder, and by its presence aflects the forming of amete! surface on aluminum that will cause the latter to take theordinary solder without the use of any additional flux. is particularlydmirsble as it is well how how 29 cult it is to properly solder aluminumThe material produced as above may be used in powdered or granular formas a solder and flux combined, but by preference I combine this powderedsolder and flux into sticks or cakes by high pr. when so the finelydivided cles oi solder (tin and lead) and the finely divided porticlesof zinc ammonium chloride d the finely divided powdered metallic zincere all forced into interlocmng relation to homeous mass whichindefinitely its rigid condition and retains the seversl cotuents intheir proper mixed relstion with such other. powdered amount of fluxinto juxtaposition with the proper amount oi solder and these ratios ofquantities are thus maintained by the pressing opera- This' thoroughmixing of the ents brings lust the proper tions'."

The barsor 1 1-: are pressed into moulds un-' der about five tonsvpressure although I do not care to limit myself to any definite pressureany pr are, l would be suficient that would thoroughly lock the drypowders of the difi'erent in= ents together.

Attention is especially called to the fact t oil of the ingredients thatgo to make up this solder and flux ore combined in e finely dividedcondition d in their dry state end no artificial the work and just theright amount of solder d flux are applied at any given point on the mewto be soldered.

It will be further unders that by themso culier method of combining theingredients of this invention that all moisture or liquid is ebsent fromthe combined mixture and the same is prevented from absorbing moistureafter it is made and thus deterioration of the solder and the flux isprevented. Such deterioration is always present in combined solders andfluxes when any moisture is present such as might be contained in abinder for the elements or because of absorption of moisture after beingmanufactured.

Having thus described my invention, what I claim as new and desire tosecure by Letters Petent is:

1. A soldering stick or cake comprising finely powdered, dry zincammonium chloride and finely powdered, dry tin and lead formed, freefrom the action of en artificial binder, into a dry homogeneousinterlocking structure by high pressm-e.

metellie zinc formed, free from the o emeeme 2. A eoldering'stici; orwire comprising powdered, dry zinc ernrnonium chic powdered, dry tin andlead and finely -l ertificiel binder, into a. dry homogeneo lockingstructure by high pressure.

3. The method of producing e, or cake, which comprises thoroughly combinpowdered zinc ammonium chloride, dry tin and lead, and powdered, drymetniflic in e loose dry state, and then subjecting H

